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Bulletin I0118J rev. A 05/01
SC275.....5. Series
SCHOTTKY DIE 275 x 275 mils
a c
0.35 0.01 (14 0.4)
NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS).
D b d
C A
O 40 (157)
3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.01 (275 + 0, - 0.4) b = 6.98 + 0, - 0.01 (275 + 0, - 0.4) c = 6.48 + 0, - 0.01 (269 + 0, - 0.4) d = 6.48 + 0, - 0.01 (269 + 0, - 0.4) O = 1.5 0.2 (60 8) 4. LETTER DESIGNATION: A = Anode (Top Metal) C = Cathode (Back Metal) D = Reject Ink Dot (only on non-conforming dies) 5. SAWING: Recommended Blade SEMITEC S1025 QS00 Blade Sawing Street 0.05 + 0, - 0.005 (2 + 0, - 0.2)
Wafer flat alligned with side b of the die
O 125 (492)
NOT TO SCALE
NOTE: 10 mils die thickness is available on specific request only.
Contact factory for information.
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SC275.....5. Series
Bulletin I0118J rev. A 05/01
Electrical Characteristics
Device # SC275R015x5x SC275S020x5x SC275S030x5x SC275S045x5x SC275S060x5x SC275H045x5x SC275H100x5x SC275H150x5x TJ Max. (C) 125 150 150 150 150 175 175 175 VR (V) 15 20 30 45 60 45 100 150 1350 Typ. IR @ 25C (A) Typ. IR @ 125C (mA) Max. VF @ IF (V) Package Style
n.a. contact factory n.a. contact factory 550 0.55 @ 150A TO-249AA
n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory n.a. contact factory
Mechanical Data
Device # SC275xxxxA5x SC275xxxxS5x Bondable Solderable -Ti 2 kA Metal Thickness Front Metal Al/Si 30 kA Ni 1 kA -Ag 35 kA Cr 1 kA Cr 1 kA Metal Thickness Back Metal Ni 2 kA Ni 2 kA Ag 3 kA Ag 3 kA
Recommended Storage Environment: Store in original container, in dessicated nitrogen, with no contamination. Shelf life for parts stored in above condition is 2 years. If the storage is done in normal atmosphere shelf life is reduced to six months.
Packaging
Device # SC275xxxxx5B SC275xxxxx5R SC275xxxxx5P SC275xxxxx5F Description Minimum Order Quantity Die in Sale Package 180 n.a. 366 180
Inked Probed Unawn Wafer (Wafer in Box) Probed Die in Tape & Reel Probed Die in Waffle Pack Inked Probed Sawn Wafer on Film
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SC275.....5. Series
Bulletin I0118J rev. A 05/01
Ordering Information Table
Device Code
SC 275
1 1 2 3 4 5 6 7 Schottky Die Chip Dimension in Mils Process (see Electrical Characteristics Table) Voltage code: Code = VRRM 2
S
3
030
4
S
5
5
6
B
7
H = 830 Process R = OR'ing Process S = Standard Process
Chip surface metallization (see Mechanical Data Table) Wafer Diameter in inches Packaging (see Packaging Table)
Wafer on Film
STEEL FRAME
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SC275.....5. Series
Bulletin I0118J rev. A 05/01
Wafer in Box
ROUND CONTAINER
TYVEK DISK
FOAM DISK
Die in Waffle Pack
CHIP TRAY POCKET
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SC275.....5. Series
Bulletin I0118J rev. A 05/01
WORLD HEADQUARTERS: EUROPEAN HEADQUARTERS: IR CANADA: IR GERMANY: IR ITALY: IR FAR EAST: IR SOUTHEAST ASIA: IR TAIWAN: http://www.irf.com
233 Kansas St., El Segundo, California 90245 U.S.A. Tel: (310) 322 3331. Fax: (310) 322 3332. Hurst Green, Oxted, Surrey RH8 9BB, U.K. Tel: ++ 44 1883 732020. Fax: ++ 44 1883 733408. 15 Lincoln Court, Brampton, Markham, Ontario L6T3Z2. Tel: (905) 453 2200. Fax: (905) 475 8801. Saalburgstrasse 157, 61350 Bad Homburg. Tel: ++ 49 6172 96590. Fax: ++ 49 6172 965933. Via Liguria 49, 10071 Borgaro, Torino. Tel: ++ 39 11 4510111. Fax: ++ 39 11 4510220. K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo, Japan 171. Tel: 81 3 3983 0086. 1 Kim Seng Promenade, Great World City West Tower,13-11, Singapore 237994. Tel: ++ 65 838 4630. 16 Fl. Suite D.207, Sec. 2, Tun Haw South Road, Taipei, 10673, Taiwan. Tel: 886 2 2377 9936. Data and specifications subject to change without notice.
Fax-On-Demand: +44 1883 733420
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